Pernec Corporation Berhad - PERNEC Telco Assembly of PCB and Equipment

Products
Solutions
- Transmission and Access Network
  - WiFI VoIP Solution
- Value Added Services
  - Carrier Cockpit Suite
  - IP Call Center Solution
Services

Telco | IT | PayPoint | Green Technology

Assembly of PCB and Equipment

Turnkey work (from purchasing parts until product delivery) for PCB assembly and assembly of casing, packaging and equipment is available at PAN. High skilled & experienced manpower with superior quality assurance will satisfy customer's requirement. PAN is capable to modify or upgrade existing products based on customer requirement.

Our SMT line capable for Ball Grid Array (BGA) of 0.4 mm, the Quad Flat Pack (QFP) of 0.3 mm and the smallest chip size of 0402 in mil or 1005 in mm.